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								Course No: EECE.5040; Last Offered: Spring 2026;
								Course Description
								Fabrication of resistors, capacitors, p-n junction and Schottky Barrier diodes, BJT's and MOS devices and Integrated circuits. Topics include: silicon structure, wafer preparation, sequential techniques in micro-electronic processing, testing and packaging, yield and clean room environments. MOS structures, crystal defects, Fick's laws of diffusion; oxidation of silicon, photolithography including photoresist, development and stripping. Metallization for conductors, Ion implantation for depletion mode and CMOS transistors for better yield speed, low power dissipation and reliability. Students will fabricate circuits using the DSIPL Laboratory.
								Prerequisites & Notes
								
									- Prerequisites: 
 
									- Special Notes: 
 
									
										- Credits: 3; Contact Hours: 3
 
									
								
								Questions About This Course?
								
									Contact the Advising Center at 978-934-2474 or 
									Continuing_Education@uml.edu
								
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